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New "laser chip - photonic circuit" coupling strategies for sensor and LIDAR applications

Technological challenge: Photonics, Imaging and displays (learn more)

Department: Département d'Optronique (LETI)

Laboratory: Laboratoire Assemblage et Intégration pour la Photonique

Start Date: 01-09-2022

Location: Grenoble

CEA Code: SL-DRT-22-0669

Contact: laurent.mendizabal@cea.fr

The development of silicon photonics technology has made it possible to the integrate numerous photonic functions on the same chip, as close as possible to electronic functions, allowing the miniaturization of components in the fields of datacom, telecom and optical sensors. However, optical communication from chip to chip remains a key point to be developed (in the case of functions that cannot yet be integrated on silicon or an architectural need at the system level, for example). Today, the available solutions are based on microoptical techniques that do not meet the needs of emerging applications (LIDAR, HPC, etc.) The objective of this thesis is to develop one or more optical coupling solutions, combining "guided optics" and optical packaging (assembly of optical chips or components at the component level), by co-designing the coupling interfaces and the chips them-selves. For this purpose, design studies by finite element and Monte Carlo simulations will be performed in a first step. The proposed concepts will then be developed based on microelectronics technologies, in association with emerging ones in the field of photonics (nanoimprint lithography, additive manufacturing?) to be evaluated to judge their relevance.

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