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Overlay measurements for advanced technologies

Technological challenge: Advanced nano characterization (learn more)

Department: Département des Plateformes Technologiques (LETI)

Laboratory: Laboratoire Microscopie Mesures et Défectivité

Start Date: 01-10-2022

Location: Grenoble

CEA Code: SL-DRT-22-0380

Contact: yoann.blancquaert@cea.fr

Overlay (OVL) is one of the key parameters to be monitored during the microelectronic components fabrications. Currently, this parameter is monitored by imaging techniques or by scatterometry. For the most advanced technologies - CMOS10nm and beyond - these techniques, although accurate (<0.4nm in 3 sigma), have difficulty to meet the needs of the process. Other techniques need to be evaluated by simulations and experimentally to achieve lower accuracies. CD-SAXS and CD-SEM are the two techniques that need to be evaluated for this ultimate metrology. The accuracy of current techniques will be evaluated, new measurement methodologies will be defined and inter-technique reference standards will be created. This subject is in the continuity of ongoing European collaborations and programs.

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