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Plasma / surface interaction sutdy for innovative wafer bonding processes

Technological challenge: Emerging materials and processes for nanotechnologies and microelectronics (learn more)

Department: Département des Plateformes Technologiques (LETI)

Laboratory: Laboratoire Gravure

Start Date:

Location: Grenoble

CEA Code: SL-DRT-22-0362

Contact: aurelien.sarrazin@cea.fr

For microelectronics industry, SOI (Silicon on Insulator) structure elaboration for the new generation of integrated circuits fabrication relies on wafer bonding by molecular adherence technology. It is based on direct bonding between two surfaces thanks to plasma activation. In the Ph.D.'s framework, we propose to study and to develop new activation processes by plasma in order to reach industrials needs. Ph.D. program's purpose is to deeply study interactions plasma-surface to better understand wafer bonding and to be able to improve the process. This study has a strong innovative potential as first studies performed had led to patent pending which will be exploited during the PhD work. To lead your research activity, you would be able to benefit privileged environment offered by CEA-Leti with state of the art tool for process development and for characterization (plasma and surface). You will work on last generation plasma activation tools associated with in-situ plasma diagnostic devices (OES). You will characterize the surface using nmerous tools for physicochemical and topographical analyses (FTIR, XPS, AFM, OCA, etc.). Ph.D program will take place in the highly technological ecosystem of CEA-Leti in Grenoble : Clean-rooms from Technological Platform Department (DPFT) and Nano-Characterization Platform (PFNC).

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