Scientific direction Development of key enabling technologies
Transfer of knowledge to industry

PhD : selection by topics

Engineering science >> Electronics and microelectronics - Optoelectronics
8 proposition(s).

Interleaved current source inverters for high power PV converters prototyping

Département des Technologies Solaires (LITEN)



Conventionally, systems for converting electrical energy in the photovoltaic domain are voltage inverter type structures [4] - [7]. In this case, the conversion chain of the photovoltaic energy is composed of two stages: a DC-DC converter followed by a voltage inverter (VSI). These voltage source topologies have short-term disadvantages (link capacitor lifetime problems) [5], [8], [9] and relatively low efficiency (due to a double conversion) [5]. As an alternative solution, the current inverter (CSI) structure can be used. Among the advantages of the CSI structure, can be listed: -A reduction in the number of power components, due to the conversion of energy with a single conversion stage [5] -A longer converter lifetime (compared to conventional structures) due to the suppression of the link capacitor [5], [8], [9] and a voltage in the blocked state seen by the switches lower [11] -Integration of natural short-circuit protection On the other hand, the CSI topology has the following disadvantages: -Relatively high conduction losses due to the series connection of devices (MOSFET + Diode) [4], [6] -Special protection requirements for AC and DC sides [4] For the CSI topology, one possible way to overcome the disadvantage of high switching losses is to use Wide bandgap devices (WBGs). Specifically, SiC semiconductors, because of their higher voltage ranges. The LSPV is currently working on: -The characterization of WBG semiconductors in 1.7kV blocking voltage -The design and building of a 100 kW CSI (using custom modules) -The characterization of the efficiency of the converters by calorimetric methods -The study and building of a high power multi-level CSI converter The subject of the thesis is the logical continuity of this work with an important part relative to the control of the structure, the interleaving of the blocks, the reduction of the size of the input inductor. [1] Jäger-Waldau, A. (2016). PV Status Report 2016. JRC Science for Policy Report (Publications Office of the European Union, 2016). [2] Photovoltaics report. Fraunhofer Institute for Solar Energy Systems-ISE, Freiburg, November 2016. Retieved May 2017. [3] BURGER, Bruno. Power Electronics for Photovoltaics. 2015. [4] Sahan, B., Araujo, S. V., Noding, C., & Zacharias, P. (2011). Comparative evaluation of three-phase current source inverters for grid interfacing of distributed and renewable energy systems. IEEE Transactions on Power Electronics, 26(8), 2304-2318. [5] Bülo, T., Sahan, B., Nöding, C., & Zacharias, P. (2007, September). Comparison of three-phase inverter topologies for grid-connected photovoltaic systems. In Proc. 22nd Eur. Photovolt. Sol. Energy Conf. Exhib., Milan, Italy. [6] Martin, J., Bier, A., Catellani, S., Alves-Rodrigues, L. G., & Barruel, F. (2016, May). A high efficiency 5.3 kW Current Source Inverter (CSI) prototype using 1.2 kV Silicon Carbide (SiC) bi-directional voltage switches in hard switching. In PCIM Europe 2016; Proceedings of (pp. 1-8). VDE. [7] Sahan, B., Vergara, A. N., Henze, N., Engler, A., & Zacharias, P. (2008). A single-stage PV module integrated converter based on a low-power current-source inverter. IEEE Transactions on Industrial Electronics, 55(7), 2602-2609. [8] Wang, H., Liserre, M., & Blaabjerg, F. (2013). Toward reliable power electronics: Challenges, design tools, and opportunities. IEEE Industrial Electronics Magazine, 7(2), 17-26. [9] Yang, S., Bryant, A., Mawby, P., Xiang, D., Ran, L., & Tavner, P. (2011). An industry-based survey of reliability in power electronic converters. IEEE Transactions on Industry Applications, 47(3), 1441-1451. [10] Engler, A., et al. "Design of a 200W 3-phase module integrated PV inverter as part of the European project PV-MIPS." Proceedings of the 21st European Photovoltaic Solar Energy Conference and Exhibition, Dresden, Germany. 2006. [11] Felgemacher, C., Araujo, S. V., Noeding, C., & Zacharias, P. (2016, May). Benefits of increased cosmic radiation robustness of SiC semiconductors in large power-converters. In PCIM Europe 2016; Proceedings of (pp. 1-8). VDE. [12] Rashid, M. H. (2010). Power electronics handbook: devices, circuits and applications. Academic press.

Nonlinear compressive imaging for machine learning

Département Architectures Conception et Logiciels Embarqués (LIST-LETI)

Laboratoire Circuits Intégrés, Intelligents pour l'Image



In a context where the deployment of image sensors combined with computer vision tend to grow very quickly, the major challenges lie in information and signal processing. In the field of smart low-power sensors, the emerging breakthrough technology named Compressive Sensing is of major interest. In the case of embedded systems, autonomous decision-making becomes one of the core device feature while available resources (i.e., memory load, computing complexity and power consumption) remain highly limited. Indeed, the power consumption due to the sensor with dedicated signal processing is largely related to the overall data bandwidth and involved signal dimensionality. In particular, recent theoretical results demonstrate that standard Machine Learning approach can be advantageously applied in the compressed signal domain. However, those results are only restricted to the methods said as « linear », i.e. based on linear projections. The first objective of this PhD will thus be to properly identify theoretical limitations related to the combination of advanced Machine Learning with Compressive Sensing. It will aim at providing cutting-edge algorithm principles outperforming state-of-the-art tradeoffs between resources and inference accuracy. Thanks to a solid background in the laboratory on these fields of research, the goal of this thesis will be to evaluate the interest of introducing non-linearity during the acquisition process in order to improve the overall efficiency. This will help to define proper levers for smart sensor design enabling close-to-sensor context recognition (e.g., specific object detection with a highly limited hardware).

Study of 300-GHz electronically reconfigurable transmitarray antennas in monolithic technology

Département Systèmes

Laboratoire Antennes, Propagation, Couplage Inductif



Due to the scarcity of electromagnetic spectrum resources and the need of broad bandwidth for high data-rate communications, the millimetre wave (mm-wave) and sub-THz bands from 30 to 350 GHz are very attractive for 5G and beyond 5G applications. In this context, high gain electronically reconfigurable antennas with beam-steering, multi-beam, and beam-forming capability are required in a huge number of emerging applications for radar, sensing, and communication systems (civil and military) typically ranging from C-band (4-8 GHz) to W-band (75-110 GHz). Typically composed of one or more radiant surfaces operating in transmission mode and illuminated by one or more focal sources, transmitarrays (also called discrete lens) are a recent cutting-edge antenna concept. Transmitarrays are realized using multilayer printed circuit technologies compatible with the integration of the active devices (diodes, MEMS, NEMS, semi-conductors, etc.). These devices can be used to control the electromagnetic field on the array aperture with excellent performances (bandwidth, cross-polarization level). CEA and IETR (university of Rennes I) have a very strong and unique expertise on transmitarray antennas. The previous realized studies form 2006 demonstrated the potentiality of transmitarrays in X-band (8-12 GHz), in Ka-band (28-40 GHz), and in V-band (50-70 GHz). The major scientific & technical innovations beyond the state-of-the-art are the following: first experimental demonstrations ? at world level ? (1) of highly efficient (70%) and highly directive (gain > 43 dBi) flat antennas at 300 GHz, (2) of ultra-flat transmitarray antennas, and (3) of self-alignment techniques for highly-directive flat antennas beyond 80 GHz.

Low Level Programming model for not "Von Neumann" architecture

Département Architectures Conception et Logiciels Embarqués (LIST-LETI)

Laboratoire Infrastructure et Ateliers Logiciels pour Puces



Since the 60s the programming model used by processors is the "Von Neumann" model in which a processor will look for instructions and data to be processed in the same memory. Increasing the transistor density on a chip has increased its frequency but has produced a "bottleneck" to the memory that can not provide instructions and data at the same frequency : the memory wall. Many architectural solutions have been proposed to solve this bottleneck. One of the solutions we are studying is an architecture in which calculations are made in memory, without moving the data to the processor. The evaluation of this solution has shown impressive potential gains in speed (x10000) and energy (x30). To exploit this potential, it is necessary to change the programming model because the instructions will no longer be read in memory but generated by a processor that will drive one or more memory plane. The subject of the thesis will be the compilation of a high-level language to a flow of instructions interleaving processor instructions responsible for controlling and calculating addresses and instructions for controlling calculations in memory. This subject is a part of a bigger project in which we create a system composed of processor and computing memory.

Miniature and directive antenna design with frequency agility over several octaves

Département Systèmes

Laboratoire Antennes, Propagation, Couplage Inductif



The 'New Space' sector pushes for innovative solutions concerning on board micro-satellites antenna design. With smaller satellites, the miniaturization of directive and extremely wide band antenna represents a solution to fill the requirements of a lot of services. The double circular polarization needs to be ensure properly over more than 2 octaves. The CEA Leti antenna laboratory proposes to skirt the classical antenna physical limitation (bandwidth / miniaturization) by tuning the antenna on a smaller instant sub-band that can be shifted with reconfigurable RF components. This is the concept of antenna aperture tuning. The novelty of the PhD subject is to extend the tuning range over several octaves thanks to tunable capacitors developed at CEA Leti. The challenge consists to optimize the miniaturization of the antenna structure while limiting the impact of losses introduced by the tunable capacitors and get a performance stability over several octaves. Prototypes will be realized and measured in the CEA Leti or CNES anechoic chamber.

3D Thermomechanical Modeling of Printed Circuit Boards




The digital transition is illustrated in the factory of the future by the instrumentation of tools and parts evolving in extremely harsh environments for the Internet of Things. In order to ensure an efficient and robust integration, the study proposed in the context of this thesis aims to acquire knowledge of design constraints, and to implement the modeling and simulation tools that allow the collaborative mechanical and electronical design of future intelligent industrial systems

Electronic packaging by cold spray metallic encapsulation




The digital transition is illustrated in the factory of the future by the instrumentation of tools and parts evolving in extremely harsh environments for the Internet of Things. One of the difficulties is to integrate wireless communicating functions inside metallic parts, in particular for purposes of traceability with RFID tags. Due to the difficulties associated with the delicate electromagnetic environment, there are no integration solutions in the state of the art. The aim of this study is to investigate the potentialities offered by the Cold Spray technique, by characterizing the beneficial effects of texture on the metal absorption properties thus implemented to encapsulate the electronic chip.

Study of DNA origami?surface interactions for application in lithography

Département Technologies Silicium (LETI)




In nanotechnology in general and semiconductor industry in particular, there is an ever increasing need for smaller and more complex features at an ever lower cost. Some examples of applications are sub-10 nm features for creation of FinFETs, lateral (horizontal) and vertical gate-all around nanowires, single electron transistors and advanced non-volatile memories (STT-RAM, MRAM, OxRAM, etc.). To address the challenge of patterning at sub-10 nm features novel patterning approaches must be envisioned. DNA (deoxyribonucleic acid), by virtue of its inherent small diameter (2 nm), tendency to self-organize into various different morphologies and its possibilities for functionalization, offers the possibility to realize both two- and three dimensional structures at nanometer scale. The goal of this PhD work is to demonstrate the feasibility of nanostructuring the surface of a substrate using DNA origami as a mask, with an ultimate resolution of a few nanometer, with a density that is above the current state of the art in semiconductor industry. The focus of the internship will lie on ever more complex features, while ensuring long-range order by conventional lithography guide patterns. The last part of the thesis consists of the effective transfer of the DNA pattern into the substrate.

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