Scientific direction Development of key enabling technologies
Transfer of knowledge to industry

PostDocs : selection by topics

Engineering sciences >> Materials and applications
2 proposition(s).

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Compressed Sensing Electron Tomography: Quantitative Multi-dimensional Characterization of Nanomaterials

Département des Plateformes Technologiques (LETI)

Autre laboratoire



Electron tomography (ET) is a well-established technique for the 3D morphological characterization at the nanoscale. ET applied to spectroscopic modes for 3D structural and chemical analysis has become a hot topic but necessitates long exposure times and high beam currents. In this project, we will explore advanced compressed sensing (CS) approaches in order to improve the resolution of spectroscopic ET and reduce significantly the dose. More precisely, we will focus on the following two tasks: 1. Comparison of total variation minimization, orthogonal or undecimated wavelets, 3D curvelets or ridgelets and shearlets for nano-objects with different structures/textures; 2. Comparison of PCA and novel CS-inspired methods such as sparse PCA for dimensionality reduction and spectral un-mixing. The code will be written in Python, using Hyperspy ( and PySAP ( libraries. The project follows a multidisciplinary approach that involves the strong expertise of the coordinator in ET and the input of two collaborators with complementary skills: Philippe Ciuciu with expertise in MRI (DRF/Joliot/NEUROSPIN/Parietal) and Jean-Luc Starck with expertise in cosmology, signal processing and applied maths (DRF/IRFU/DAP/CosmoStat). The three communities share a strong interest in compressed sensing algorithms.

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The purpose of the PEAM Post-Doctoral Study is to leverage the benefits of additive manufacturing for the packaging and integration of electronic functions in harsh environments. The targeted applications are intelligent tools for more performance, more quality control, and smart parts for added value, especially in terms of maintenance. The topological optimization of objects designed by additive manufacturing makes it possible to position the electronic functions in the best place within the framework of a real mechanical and electronic co-design, in order to ensure the measurement function as close as possible to the centers of interest (integration), and in the best conditions of protection (packaging). The project must allow us to select the technologies capable of adding electronic functions by adding material for the elements of routing and interconnections, as well as resistive sensors and passive components (on passivated substrates or dielectric supports), then encapsulate these elements without degradation of its reliability.

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